Inside the Event Revealing the Future of High Efficiency Electronics
The annual Applied Power Electronics Conference returned with a clear message for the industry. Power technology is moving quickly and companies are racing to deliver smaller, cooler, and more efficient solutions for everything from data centers to robotics. Exhibitors filled the floor with new components that promise higher power density and simpler design, reflecting the growing demand for systems that can handle heavier workloads without adding bulk or complexity. Wide bandgap materials such as gallium nitride and silicon carbide continued to dominate the conversation as engineers look for ...
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